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Conference Brief

Thank you for reading the IEEE Electron Devices Society (EDS), Conference Brief. If you have EDS-specific conference news to share with your EDS colleagues, please send an email for possible publication in an upcoming Conference Brief.

FEATURED CONFERENCES

[ Image ] [[https://2023.ifetc.org/]]

The 5th IEEE International Flexible Electronics Technology Conference (IFETC)

San Jose, California

14-16 August 2023

 

The 5th IEEE International Flexible Electronics Technology Conference (IFETC) 2023 is a three-day technical conference to be held at the Silicon Valley DOUBLETREE BY HILTON hotel in San Jose, California, USA from 14-16 August 2023. The IEEE Electron Devices Society (EDS) sponsored IFETC is a premier conference for the flexible/printable electronics device technology community. The IFETC provides a unique forum for discussions on a broad range of flexible/printable electronics device/manufacturing-related topics including sensors, displays, and in general large area flexible electronics systems. IFETC conference location rotates between North America, Asia, and Europe.

Conference Website

 
PVSC 2023
[ PVSC 2023 ] [[https://www.esscirc-essderc2023.org/]]

The IEEE 53rd European Solid-State Device Research Conference (ESSDERC) & IEEE 49th European Solid State Circuits Conference (ESSCIRC)

Lisbon, Portugal

11-14 September 2023

 

The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on-chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers and system designers is necessary.

ESSCIRC and ESSDERC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both device and circuit communities. Attendees registered for either conference are encouraged to attend any of the scheduled parallel sessions, regardless to which conference they belong.

Conference Website

PVSC
[ PVSC ] [[https://ewh.ieee.org/conf/edtm/2024/index.php]]

The 8th Electron Devices Technology and Manufacturing Conference (IEEE EDTM 2024)

Bangalore, India

03-06 March 2024

 

The 8th Electron Devices Technology and Manufacturing Conference (IEEE EDTM 2024) will be held for the first time in India at Bangalore; the Silicon Valley of India and the hub of semiconductor companies. IEEE EDTM 2024 will be a full four-day conference to be held during 3-6 March 2024. IEEE EDTM 2024 aims to be a premier global forum for researchers and engineers from around the world coming to share new discoveries and discuss about any device/manufacturing-related topics, including but not limited to, materials, processes, devices, packaging, modeling, reliability, manufacturing and yield, tools, testing, and any emerging device technologies, as well as workforce training. The Theme for IEEE EDTM 2024 is: Strengthening Globalization in Semiconductors.

Conference Website

CALL FOR PAPERS

LAEDC 2023
[ LAEDC 2023 ] [[https://bcicts.org/]]
 

The IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)

 

15-18 October 2023 / Monterey, CA

 

The abstract submission deadline is: 14 August 2023

Conference Website

Read Details Here

LAEDC 2023
[ LAEDC 2023 ] [[https://www.ieeesisc.org/]]
 

The 54th IEEE Semiconductor Interface Specialists Conference (SISC)

 

13-16 December 2023 / San Diego, CA

 

The abstract submission deadline is: 6 August 2023

Conference Website

Read Details Here

LAEDC 2023
[ LAEDC 2023 ] [[https://ewh.ieee.org/conf/edtm/2024/index.php]]
 

IEEE Electron Devices Technology and Manufacturing (IEEE EDTM)

03-06 March 2024 / Bangalore, India

 

The abstract submission deadline is: 15 September  2023

Conference Website

Read Details Here

LAEDC 2023
[ LAEDC 2023 ] [[https://www.isqed.org/]]
 

The 25th International Symposium on Quality Electronic Design (ISQED'24)

03-05 April 2024 / San Francisco, CA

 

The abstract submission deadline is: 29 September  2023

Conference Website

Read Details Here

LAEDC 2023
[ LAEDC 2023 ] [[https://icmts.net/]]
 

The International Conference on Microelectronic Test Structures (ICMTS)

 

15-18 April 2024 / Edinburgh, Scotland

The abstract submission deadline is: 27 October 2023

Conference Website

Read Details Here

UPCOMING CONFERENCES

2023 IEEE International Flexible Electronics Technology Conference (IFETC)

San Jose, CA USA | 13 - 16 Aug. 2023

2023 21st Non-Volatile Memory Technology Symposium (NVMTS)

Leuven, Belgium | 30 Aug. - 01 Sept. 2023

2023 16th UK-Europe-China Workshop on Millimetre Waves and Terahertz Technologies (UCMMT)

Guangzhou, China | 31 Aug. - 03 Sept. 2023

2023 16th UK-Europe-China Workshop on 2023 IEEE XXVIII International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED)

Tbilisi, Georgia | 11 - 13 Sept. 2023

IEEE 49th European Solid-State Circuits Conference (ESSCIRC) & IEEE 53rd European Solid-State Device Research Conference (ESSDERC)

Lisbon, Portugal | 11 - 14 Sept. 2023

2023 IEEE International Conference on Quantum Computing and Engineering (QCE)

Bellevue, WA | 17 - 22 Sept. 2023

2023 18th European Microwave Integrated Circuits Conference (EuMIC)

Berlin, Germany | 18 - 19 Sept. 2023 

2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

Kobe, Japan | 26 - 29 Sept. 2023

2023 45th Annual EOS/ESD Symposium (EOS/ESD)

Riverside, CA USA | 01 - 06 Oct. 2023

2023 IEEE International Integrated Reliability Workshop (IIRW)

South Lake Tahoe, CA | 08 - 12 Oct. 2023

2023 International Semiconductor Conference (CAS)

Sinaia, Romania | 11 - 13 Oct. 2023

2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)

Monterey, CA USA | 14 - 18 Oct. 2023

2023 IEEE 33rd International Conference on Microelectronics (MIEL)

Nis, Serbia | 16 - 18 Oct. 2023

2023 20th International Conference on Electrical Engineering, Computing Science and Automatic Control (CCE)

Ciudad de México, Mexico | 25 - 27 Oct. 2023

2023 Symposium on Internet of Things (SIoT)

São Paulo, Brazil | 25 - 27 Oct. 2023

2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)

San Francisco, CA USA | 28 Oct. - 02 Nov. 2023

2023 Middle East and North Africa Solar Conference (MENA-SC)

Dubai, United Arab Emirates | 15 - 18 Nov. 2023

2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)

Charlotte, NC USA | 04-06 Dec. 2023

2023 International Electron Devices Meeting (IEDM)

San Francisco, CA USA | 09 - 13 Dec. 2023

2023 IEEE 54th Semiconductor Interface Specialists Conference (SISC)

San Diego, CA USA | 13 - 16 Dec. 2023

 

EDS CHAPTER EVENTS

 
Interested in joining an EDS Chapter Event?
 

CONFERENCE NEWS

2023 IEEE INTERNATIONAL MEMORY WORKSHOP (IMW)


The 15th International Memory Workshop (IMW) took place at the Hyatt Regency Hotel in Monterey, CA, from 21-24 May 2023. After the fully virtual 2020 and 2021 editions, and the hybrid 2022 edition held in Dresden, this year’s IMW was the first on-site only after the Covid pandemic, returning to the true interactive Workshop format.

 

The IMW is sponsored by the IEEE Electron Devices Society and meets annually in May. The workshop is a unique forum for specialists in all aspects of semiconductor memories (non-volatile & volatile). The scope of workshop content ranges from new memory concepts in early research to the technology drivers currently in volume production as well as emerging technologies in development. The technical sessions are organized in a manner that provides ample time for informal exchanges among presenters and attendees. More than 150 people took part in our meeting this year.

 

This year’s program included a one-day short course, with tutorials on TCAD and Modeling and on DNA memory, delivered by experts on the topics from both the industry and academia. The technical program for single-track conference spanned three days and opened with keynote talks by Alessandro Gorsso (Infineon) on RRAM technology for automotive, Jeongdong Choe (TechInsights) on the status of STT-MRAM technology, and Sunil Sim (Samsung) on 3D NAND Flash.

 

The program included invited talks given by experts in memory field – Wei-Chen Chen (Macronix), Konrad Seidel (Fraunhofer), Biswajit Ray (Univ. Alabama), Antonio Conte (ST Microelectronics), Bhagwati Prasad (Indian Institute of Science Bangaluru), Sebastian Couet (imec), and Bala Haran (Applied Materials) - providing an exciting overview of the main trends for memory technologies and applications. 

 

The IMW is also an excellent forum to present new and original technical works and this year’s technical program comprised 31 excellent papers, which included 17 oral presentations and 14 posters. The papers were selected by the technical committee among more than 59 papers submitted and covered the major categories of memory technologies (3D NAND, 3D DRAM, Ferroelectric, STT, RRAM, PCM, and selectors) and NVM applications (Automotive, In-memory and Neuromorphic Computing).

 

Among the exciting news presented at the conference, the paper titled “Process improvements for the 7th generation 1Tb Quad-Level Cell 3D NAND Flash Memory in Mass Production” presented by Soochan Kyle Chung (Samsung) won the Best Paper Award, and the paper “ Proposal of P-channel FE NAND with High Drain Current and Feasible Disturbance for Next Generation 3D NAND” presented by Song-hyeon Kuk (Korean Advanced Institute of Science and Technology) received the Best Student Paper Award. 

 

Another highlight of the conference was the panel discussion on the topic “Can 3D structuring be a technology driver for memory like it was for NAND?”, hosted by Tomoya Sanuki (Kioxia).

 

The next IMW will be held in May 2024 in Seoul, South Korea.

 
IMW Conference Website
IMW Technical Proceedings
 

CONFERENCE UPDATES

Contract review

All conference-related purchase transactions valuing US$1,000 or greater must be reviewed by the IEEE Conference Contracts Department before execution.

 

You may refer to the following chart for guidance on the appropriate review process for your transaction.

 
img
[ img ] [[https://www.ieee.org/conferences/organizers/contracts.html]]
 

 

IEEE Travel Policy Update

At this time, in line with the advice of health authorities regarding current pandemic risks and a return to in-person meetings and domestic and international travel in many regions, the current IEEE pandemic travel policy is rescinded. This policy is replaced with the following:

 

1. All IEEE Volunteer travel and associated meetings must adhere to all appropriate guidance from cognizant local public health authorities. Local policies around meetings and travel vary across the globe and continue to evolve.

 

2. Volunteers engaged in IEEE related travel and in-person activities acknowledge the continuing risk of exposure to COVID-19. Volunteers should understand that IEEE will not indemnify them for any health risk or economic or other loss resulting from exposure to COVID-19 during IEEE activities.

3. IEEE will not reimburse costs associated with mandatory or self-quarantine or isolation associated with IEEE volunteer travel. If there is a risk of quarantine on entering or departing an area, IEEE volunteers should instead plan to participate virtually when possible using IEEE video and teleconferencing tools.

4. IEEE recommends that If you have any questions, you contact your OU staff business solutions manager or OU volunteer leadership. 

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