Conference Brief
 
 
 
 
Thank you for reading the IEEE Electron Devices Society (EDS), Conference Brief. If you have EDS-specific conference news to share with your EDS colleagues, please send an email for possible publication in an upcoming Conference Brief.
 
 
FEATURED CONFERENCES
 
 
 
 
The 7th IEEE Electron Devices Technology and Manufacturing Conference (EDTM 2023)
Seoul, Korea
7-10 March, 2023
 
 
 

EDTM 2023 Logo

 
 
 
 
The IEEE Electron Devices Technology and Manufacturing (EDTM) Conference was established by the IEEE Electron Devices Society (EDS) to enable further performance/functionality enhancement of semiconductor devices and systems with manufacturing innovations to overcome scaling challenges. EDTM provides the forum where device, process, material, and tool communities gather and discuss their novel ideas for technological breakthrough.EDTM rotates among Asian countries where hot-hubs of semiconductor manufacturing are located. Launched in 2017 in Toyama, Japan, EDTM was subsequently held in Kobe, Japan (2018), in Singapore (2019), in Penang, Malaysia (2020), in Chengdu, China (2021), in Oita, Japan - Full virtual (2022), and will take place first time in Seoul, Korea this year. EDTM is a premier conference, providing a unique forum for discussions on a broad range of device/manufacturing-related topics.
 
 
 
 
 
 
 
 
 
 

IEEE International Electron Devices Meeting (IEDM) 2022
San Francisco, CA
3-7 December 2022


IEEE International Electron Devices Meeting (IEDM) is the world's preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

 
 
 
 
 
 
CALL FOR PAPERS
 
 
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The IEEE International Memory Workshop  

21-24 May, 2023 / Monterey, CA


The abstract submission deadline is: 1 February, 2023

Conference Website

 
 
 
 
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The Twenty-Fourth International Vacuum Electronics Conference (IVEC 2023)

25-28 April 2023 / Chengdu, Sichuan, China


The abstract submission deadline is: 20 December 2022


Conference Website

 
 
 
 
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The 50th IEEE Photovoltaic Specialists Conference

11-16 June, 2023 / San Juan, Puerto Rico


The abstract submission deadline is: 16 January, 2023



Conference Website

 
 
 
 
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2023 25th Radio Frequency Integrated Circuits Symposium (RFIC 2023)

11-13 June 2023 / San Diego, CA 

The abstract submission deadline is: 15 January 2023


Conference Website

 
 
 
 
UPCOMING CONFERENCES
 
 
San Francisco, CA USA | 3-7 Dec. 2022
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
Chengdu, China | 25-28 Apr. 2023
Abstract Submission Date: 10 Jan. 2023
 
 
 
 
Monterey, CA USA | 21-24 May 2023
Abstract Submission Date: 1 Feb. 2023
 
 
 
 
Hong Kong | 28 May - 1 Jun. 2023
Abstract Submission Date: 12 Dec. 2022
 
 
 
 
Kyoto, Japan | 11-16 Jun. 2023
Abstract Submission Date: 1 Feb. 2023
 
 
2023 IEEE International Flexible Electronics Technology Conference (IFETC)
San Jose, CA USA | 13-16 Aug. 2023
Abstract Submission Date: 21 Apr. 2023
 
 
 
 
EDS CHAPTER EVENTS
 
 
 
 
 
 
CONFERENCE NEWS
 
 
 
 
 
 
CONFERENCE UPDATES
 
 
Contract review

All conference-related purchase transactions valuing US$1,000 or greater must be reviewed by the IEEE Conference Contracts Department before execution.

You may refer to the following chart for guidance on the appropriate review process for your transaction.
 
 
 
 
 
 
IEEE Travel Policy Update

At this time, in line with the advice of health authorities regarding current pandemic risks and a return to in-person meetings and domestic and international travel in many regions, the current IEEE pandemic travel policy is rescinded. This policy is replaced with the following:

1. All IEEE Volunteer travel and associated meetings must adhere to all appropriate guidance from cognizant local public health authorities. Local policies around meetings and travel vary across the globe and continue to evolve.

2. Volunteers engaged in IEEE related travel and in-person activities acknowledge the continuing risk of exposure to COVID-19. Volunteers should understand that IEEE will not indemnify them for any health risk or economic or other loss resulting from exposure to COVID-19 during IEEE activities.

3. IEEE will not reimburse costs associated with mandatory or self-quarantine or isolation associated with IEEE volunteer travel. If there is a risk of quarantine on entering or departing an area, IEEE volunteers should instead plan to participate virtually when possible using IEEE video and teleconferencing tools.

4. IEEE recommends that If you have any questions, you contact your OU staff business solutions manager or OU volunteer leadership.
 
 
 
 
CONFERENCE TOOLS
 
 
 
 
 
 
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