Conference Brief
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The 7th IEEE Electron Devices Technology and Manufacturing Conference (EDTM 2023)
Seoul, Korea
March 7-10, 2023

Electron Devices Technology and Manufacturing (EDTM) Conference was established by the IEEE Electron Devices Society (EDS) to enable further performance/functionality enhancement of semiconductor devices and systems with manufacturing innovations to overcome scaling challenges. EDTM provides the forum where device, process, material, and tool communities gather and discuss their novel ideas for technological breakthrough. EDTM rotates among Asian countries where hot-hubs of semiconductor manufacturing are located. Launched in 2017 in Toyama, Japan, EDTM was subsequently held in Kobe, Japan (2018), in Singapore (2019), in Penang, Malaysia (2020), in Chengdu, China (2021), in Oita, Japan – Full virtual (2022), and will take place first time in Seoul, Korea this year. EDTM is a premier conference, providing a unique forum for discussions on a broad range of device/manufacturing-related topics. 


EDTM 2023 Logo


IEEE International Electron Devices Meeting (IEDM) 2022
San Francisco, CA
3-7 December 2022

IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

2023 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 

7-10 March 2023 / Seoul, Korea

The abstract submission deadline is: 24 October 2022

Conference Website

IEEE International Reliability Physics Symposium (IRPS)

26-30 March 2023 / Monterey, California

The abstract submission deadline is: 24 October 2022

Conference Website


24th International Symposium on Quality Electronic Design (ISQED 23)

5-7 April 2023 / Santa Clara, California

The abstract submission deadline is: 9 October 2022

Conference Website

The Twenty-Fourth International Vacuum Electronics Conference (IVEC 2023)

25-28 April 2023 / Chengdu, Sichuan, China

The abstract submission deadline is: 20 December 2022

Conference Website

2023 25th Radio Frequency Integrated Circuits Symposium (IRPS 2023)

11-13 June 2023 / San Diego, CA 

The abstract submission deadline is: 15 January 2023

Conference Website

Sao Paulo, Brazil | 24-28 Oct. 2022
San Francisco, CA USA | 3-7 Dec. 2022
Seoul, Korea (South) | 7-10 Mar. 2023
Abstract Submission Date: 24 Oct. 2022
Monterey, CA USA | 26-30 Mar. 2023
Abstract Submission Date: 24 Oct. 2022
Society Membership Program

As an IEEE Electron Devices Society (EDS) member, you can take advantage of the Multiple Society Discount Program to connect across several IEEE Societies to expand your expert network and collaborate on the latest cutting-edge technical research, policy, and innovation at a discount when you become a member or renew your membership of two or more participating IEEE Societies.

If you’re already a member of two or more participating IEEE Societies, the discount will automatically be applied when you renew. If you’ve always been interested in a complementary IEEE Society, this program provides you with the opportunity to join at a discounted rate.

The IEEE Societies that complement your IEEE EDS Membership include Solid-State Circuits Society, Photonics Society, Circuits and Systems Society & Reliability Society.

Contract review

All conference-related purchase transactions valuing US$1,000 or greater must be reviewed by the IEEE Conference Contracts Department before execution.

You may refer to the following chart for guidance on the appropriate review process for your transaction.
IEEE Travel Policy Update

At this time, in line with the advice of health authorities regarding current pandemic risks and a return to in-person meetings and domestic and international travel in many regions, the current IEEE pandemic travel policy is rescinded. This policy is replaced with the following:

1. All IEEE Volunteer travel and associated meetings must adhere to all appropriate guidance from cognizant local public health authorities. Local policies around meetings and travel vary across the globe and continue to evolve.

2. Volunteers engaged in IEEE related travel and in-person activities acknowledge the continuing risk of exposure to COVID-19. Volunteers should understand that IEEE will not indemnify them for any health risk or economic or other loss resulting from exposure to COVID-19 during IEEE activities.

3. IEEE will not reimburse costs associated with mandatory or self-quarantine or isolation associated with IEEE volunteer travel. If there is a risk of quarantine on entering or departing an area, IEEE volunteers should instead plan to participate virtually when possible using IEEE video and teleconferencing tools.

4. IEEE recommends that If you have any questions, you contact your OU staff business solutions manager or OU volunteer leadership.
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