Conference Brief
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IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)
Phoenix, AZ
16-19 October 2022

The IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) technical sub-committees are organized to reflect the rapidly evolving developments in bipolar, BiCMOS and compound semiconductor circuits and devices. 




Submissions are encouraged in all areas of advanced circuits, devices and modeling, with particular emphasis on:

  • Bipolar/BiCMOS devices, circuits and technologies
  • 5G ICs, GaN HPAs/LNAs, InP THz PAs
  • High Performance RF Switch Technologies
  • GaN HEMT and other wide bandgap power devices
  • Analog, RF & Microwave ICs mmW & THz ICs
  • Process & Device Technology
  • Modeling/Simulation
  • Optical CMOS/SiGe Transceivers
  • High Speed Digital, Mixed Signal, and Electro-Optic IC’s

IEEE International Electron Devices Meeting (IEDM) 2022 San Francisco, CA
3-7 December 2022

IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

2023 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 

7-10 March 2023 / Seoul, Korea

The abstract submission deadline is: 24 October 2022

Conference Website

IEEE International Reliability Physics Symposium (IRPS)

26-30 March 2023 / Monterey, California

The abstract submission deadline is: 24 October 2022

Conference Website

The Twenty-Fourth International Vacuum Electronics Conference (IVEC 2023)

25-28 April 2023 / Chengdu, Sichuan, China

The abstract submission deadline is: 20 December 2022

Conference Website


24th International Symposium on Quality Electronic Design (ISQED 23)

April 2023 / Santa Clara, California

The abstract submission deadline is: 9 October 2022

Conference Website

Reno, NV USA | 18-23 Sept. 2022
South Lake Tahoe, CA USA | 9-13 Oct. 2022
Poiana Brasov, Romania | 12-14 Oct. 2022
Sao Paulo, Brazil
24-28 Oct. 2022
San Francisco, CA USA | 3-7 Dec. 2022
Young Professionals Mentoring Event
Sponsored by SSCS + EDS
Wednesday, 21 September, Room: AULA 10

Join the Young Professionals Mentoring Event. Connect with SSCS and EDS Society executives and luminaries in the field.

Lunch will be provided, as well as fun giveaways!

  • Introduction by the IEEE Solid-State Circuits Society (SSCS)
  • Introduction by the IEEE Electron Devices Society (EDS)
  • Ice Breaker Activity
  • Open Networking & Mentoring Session

BCICTS 2022 Advanced Program is now available!

Register Today!

The technical committee has lined up an exciting and informative array of speakers for the 2022 conference including a full day short course and a half day primer workshop.

Are you interested in staying in touch with our BCICTS community?
If so, we encourage you to join our BCICTS LinkedIn group.

For additional information: visit
Contract review

All conference-related purchase transactions valuing US$1,000 or greater must be reviewed by the IEEE Conference Contracts Department before execution.

You may refer to the following chart for guidance on the appropriate review process for your transaction.
IEEE Travel Policy Update

At this time, in line with the advice of health authorities regarding current pandemic risks and a return to in-person meetings and domestic and international travel in many regions, the current IEEE pandemic travel policy is rescinded. This policy is replaced with the following:

1. All IEEE Volunteer travel and associated meetings must adhere to all appropriate guidance from cognizant local public health authorities. Local policies around meetings and travel vary across the globe and continue to evolve.

2. Volunteers engaged in IEEE related travel and in-person activities acknowledge the continuing risk of exposure to COVID-19. Volunteers should understand that IEEE will not indemnify them for any health risk or economic or other loss resulting from exposure to COVID-19 during IEEE activities.

3. IEEE will not reimburse costs associated with mandatory or self-quarantine or isolation associated with IEEE volunteer travel. If there is a risk of quarantine on entering or departing an area, IEEE volunteers should instead plan to participate virtually when possible using IEEE video and teleconferencing tools.

4. IEEE recommends that If you have any questions, you contact your OU staff business solutions manager or OU volunteer leadership.
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