Conference Brief
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IEEE 48th European Solid State Circuits Conference (ESSCIRC) & IEEE 52nd European Solid-State Device Research Conference (ESSDERC) Milan, Italy 19-22 September 2022

The aim of ESSDERC and ESSCIRC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on- chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers and system designers is necessary.
While keeping separate Technical Program Committees, ESSDERC and ESSCIRC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both communities. Attendees registered for either conference are encouraged to attend any of the scheduled parallel sessions, regardless to which conference they belong.

  • 4 joint keynote presentations
  • 3 ESSDERC keynote presentations
  • 3 ESSCIRC keynote presentations
  • Invited papers with overall coverage of all aspects of advanced devices and circuits
  • Presentation of IEEE and ESSDERC/ESSCIRC Awards
  • ESSDERC/ESSCIRC Welcome Reception on Tuesday, 20 September 2022
  • ESSDERC/ESSCIRC Gala Dinner on Wednesday, 21 September 2022
  • Tutorials and workshops 
IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)
Phoenix, AZ
16-19 October 2022

The IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) technical sub-committees are organized to reflect the rapidly evolving developments in bipolar, BiCMOS and compound semiconductor circuits and devices. 




Submissions are encouraged in all areas of advanced circuits, devices and modeling, with particular emphasis on:

  • Bipolar/BiCMOS devices, circuits and technologies
  • 5G ICs, GaN HPAs/LNAs, InP THz PAs
  • High Performance RF Switch Technologies
  • GaN HEMT and other wide bandgap power devices
  • Analog, RF & Microwave ICs mmW & THz ICs
  • Process & Device Technology
  • Modeling/Simulation
  • Optical CMOS/SiGe Transceivers
  • High Speed Digital, Mixed Signal, and Electro-Optic IC’s
The Twenty-Fourth International Vacuum Electronics Conference (IVEC 2023)

25-28 April 2023 / Chengdu, Sichuan, China

The abstract submission deadline is: 20 December 2022

Conference Website

IEEE International Conference on Emerging Electronics (ICEE)

11-14 December 2022 / Bangalore, India

The abstract submission deadline is: 7 September 2022

Conference Website

2023 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 

7-10 March 2023 / Seoul, Korea

The abstract submission deadline is: 24 October 2022


The International Symposium on Semiconductor Manufacturing (ISSM)

December 12-13, 2022 / Ryogoku, Tokyo
The abstract submission deadline is: 22 August 2022

Conference Website

2022 10th International Symposium on Next-Generation Electronics (ISNE)

October 22-23, 2022 / Wuxi, China
The abstract submission deadline is: 01 September 2022

Conference Website

Porto Alegre, Brazil| 22-26 Aug. 2022
Reno, NV USA | 18-23 Sept. 2022
South Lake Tahoe, CA USA | 9-14 Oct. 2022
Poiana Brasov, Romania | 12-14 Oct. 2022
Wuxi, China | Abstract Submission Date: 01 Sept. 2022
22-23 Oct. 2022
Sao Paulo, Brazil
24-28 Oct. 2022
San Francisco, CA USA | 3-7 Dec. 2022
Tokyo, Japan  | Abstract Submission Date: 22 Aug. 2022
12-13 Dec. 2022

BCICTS 2022 Registration is now available!

The technical committee has lined up an exciting and informative array of speakers for the 2022 conference including a full day short course and a half day primer workshop.

Please register accordingly.

Register Today!

Are you interested in staying in touch with our BCICTS community?
If so, we encourage you to join our BCICTS LinkedIn group.

For additional information: visit
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IEEE Travel Policy Update

At this time, in line with the advice of health authorities regarding current pandemic risks and a return to in-person meetings and domestic and international travel in many regions, the current IEEE pandemic travel policy is rescinded. This policy is replaced with the following:

1. All IEEE Volunteer travel and associated meetings must adhere to all appropriate guidance from cognizant local public health authorities. Local policies around meetings and travel vary across the globe and continue to evolve.

2. Volunteers engaged in IEEE related travel and in-person activities acknowledge the continuing risk of exposure to COVID-19. Volunteers should understand that IEEE will not indemnify them for any health risk or economic or other loss resulting from exposure to COVID-19 during IEEE activities.

3. IEEE will not reimburse costs associated with mandatory or self-quarantine or isolation associated with IEEE volunteer travel. If there is a risk of quarantine on entering or departing an area, IEEE volunteers should instead plan to participate virtually when possible using IEEE video and teleconferencing tools.

4. IEEE recommends that If you have any questions, you contact your OU staff business solutions manager or OU volunteer leadership.
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