Conference Brief
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The IEEE International Flexible Electronics Technology Conference (IFETC) 2022
Qingdao, China
21-24 August 2022

The IEEE International Flexible Electronics Technology Conference (IFETC) is a four-day hybrid technical conference that is augmented with tutorials and will take place August 21-24, 2022. The conference is dedicated to flexible electronics technologies for sensors, displays, and in general large area flexible electronics systems.


IFETC-2022 Logo.JPG


Flexible electronics is at its infancy and is being continuously challenged by the growing demands for systems with better quality, lower cost, greener manufacturing, and mechanical flexibility. It goes beyond displays and wearable systems for all pervasive human-machine-environment interfaces. Therefore, the materials and manufacturing techniques at all levels have become increasingly critical for the electronics community to connect device technologies, manufacturing, and circuits & systems. IFETC is an annual conference that presents a forum for engineers and scientists to get together and present the recent developments in the area for technology development, device engineering, circuit design, and systems integration.

IEEE International Electron Devices Meeting (IEDM) 2022
San Francisco, CA
3-7 December 2022

IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.


The 53rd IEEE Semiconductor Interface Specialists Conference (SISC) 2022

7-10 December 2022 / San Diego, CA

The abstract submission deadline is: 1 August 2022

Conference Website

2022 IEEE BICMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)

16-19 October 2022 / Phoenix, AZ

The abstract submission deadline is: 15 August 2022

Conference Website

IEEE International Conference on Emerging Electronics (ICEE)

11-14 December 2022 / Bangalore, India

The abstract submission deadline is: 7 September 2022

Conference Website


The International Symposium on Semiconductor Manufacturing (ISSM)

12-13 December 2022 / Ryogoku, Tokyo

The abstract submission deadline is: 25 July 2022

Conference Website

Porto Alegre, Brazil| 22-26 Aug. 2022
Reno, NV USA | 18-23 Sept. 2022
Soth Lake Tahoe, CA USA | 9-14 Oct. 2022
Poiana Brasov, Romania | 12-14 Oct. 2022
Wuxi, China | Abstract Submission Date: 31 Aug. 2022
22-23 Oct. 2022
Sao Paulo, Brazil | Abstract Submission Date: 1 Aug. 2022
24-28 Oct. 2022
San Francisco, CA USA | 3-7 Dec. 2022
San Diego, CA USA | Abstract Submission Date: 1 Aug. 2022
7-10 Dec. 2022
Tokyo, Japan  | Abstract Submission Date: 5 Aug. 2022
12-13 Dec. 2022
49th IEEE Photovoltaic Specialists Conference, 5-10 June 2022

Monday’s Awards Session it was announced that Professor Stephen R. Forrest from the University of Michigan won the 2022 Cherry Award and presented an excellent perspective on organic PV for window power generation and BIPV applications. During this presentation Professor Forrest discussed the significant recent improvements in organic PV performance (approaching 20% PCE), which has been due to considerable innovations transport layers, particularly the realization of non- fullerene acceptor layers such that photovoltaics appears the “next big thing for organics.”
Contract review

All conference-related purchase transactions valuing US$1,000 or greater must be reviewed by the IEEE Conference Contracts Department before execution.

You may refer to the following chart for guidance on the appropriate review process for your transaction.
IEEE Travel Policy Update

At this time, in line with the advice of health authorities regarding current pandemic risks and a return to in-person meetings and domestic and international travel in many regions, the current IEEE pandemic travel policy is rescinded. This policy is replaced with the following:

1. All IEEE Volunteer travel and associated meetings must adhere to all appropriate guidance from cognizant local public health authorities. Local policies around meetings and travel vary across the globe and continue to evolve.

2. Volunteers engaged in IEEE related travel and in-person activities acknowledge the continuing risk of exposure to COVID-19. Volunteers should understand that IEEE will not indemnify them for any health risk or economic or other loss resulting from exposure to COVID-19 during IEEE activities.

3. IEEE will not reimburse costs associated with mandatory or self-quarantine or isolation associated with IEEE volunteer travel. If there is a risk of quarantine on entering or departing an area, IEEE volunteers should instead plan to participate virtually when possible using IEEE video and teleconferencing tools.

4. IEEE recommends that If you have any questions, you contact your OU staff business solutions manager or OU volunteer leadership.
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