Conference Brief
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The 25th edition of the IEEE International Interconnect Technology Conference (IITC)
27-30 June 2022
San Jose, California

On behalf of the IEEE International Interconnect Technology Conference Executive Committee, it is our pleasure to announce IEEE IITC 2022 and invite you to contribute to and attend the conference.



IITC is sponsored by the IEEE Electron Devices Society as the premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications.

The 25th edition of International Interconnect Technology Conference (IITC) is soliciting contributions highlighting innovative research and development in the critically important field of on-chip interconnects, integration and metallization, including design, unit process, integration and reliability.

2022 IEEE Latin American Electron Devices Conference (LAEDC)
4-6 July 2022

Puebla, Mexico

The IEEE LAEDC is a conference sponsored by the IEEE Electron Device society (EDS). Its main goal is to bring together specialists from all Electron Device related fields. The fourth IEEE LAEDC edition will take place in-person in Puebla, México and simultaneously virtual. The conference will be geared for students as well as young researchers. Its main goal is to bring together specialists from all Electron Device related fields. We are convinced that thanks to your significant accomplishments your presence will significantly add to the value of this growing conference.

2022 LAEDC

IEDM 2022
2022 IEEE International Electron Devices Meeting (IEDM)

7-9 December 2022 | San Francisco, CA

Submission Deadline:
14 July 2022

Conference Website

IIRW 2022
IEEE International Integrated Reliability Workshop (IIRW)

9-14 October 2022 | Fallen Leaf Lake, CA

Submission Deadline:
9 July 2022

Conference Website

UCMMT 2022
15th UK-Europe-China Workshop on Millimetre Waves and Terahertz Technologies (UCMMT)

17-19 August 2022 | Tonsberg, Norway

Submission Deadline:
1 July 2022

Conference Website

Columbus, Ohio USA | 26-29 June 2022
Porto Alegre, Brazil| 22-26 August 2022
Reno, NV USA | 18-23 Sept. 2022
Soth Lake Tahoe, CA USA | Abstract Submission Date: 9 July 2022
9-14 Oct. 2022
Poiana Brasov, Romania | 12-14 Oct. 2022
Smolenice, Slovakia | Abstract Submission Date: 3 June 2022
23-26 Oct. 2022
Sao Paulo, Brazil | 24-26 Oct. 2022
San Diego, CA USA | Abstract Submission Date: 9 Aug 2022
8-10 Dec. 2022
San Francisco, CA USA | 7-9 Dec. 2022
Tokyo, Japan | Abstract Submission Date: 5 Aug. 2022
Contract review

All conference-related purchase transactions valuing US$1,000 or greater must be reviewed by the IEEE Conference Contracts Department before execution.

You may refer to the following chart for guidance on the appropriate review process for your transaction.
IEEE Travel Policy Update

At this time, in line with the advice of health authorities regarding current pandemic risks and a return to in-person meetings and domestic and international travel in many regions, the current IEEE pandemic travel policy is rescinded. This policy is replaced with the following:

1. All IEEE Volunteer travel and associated meetings must adhere to all appropriate guidance from cognizant local public health authorities. Local policies around meetings and travel vary across the globe and continue to evolve.

2. Volunteers engaged in IEEE related travel and in-person activities acknowledge the continuing risk of exposure to COVID-19. Volunteers should understand that IEEE will not indemnify them for any health risk or economic or other loss resulting from exposure to COVID-19 during IEEE activities.

3. IEEE will not reimburse costs associated with mandatory or self-quarantine or isolation associated with IEEE volunteer travel. If there is a risk of quarantine on entering or departing an area, IEEE volunteers should instead plan to participate virtually when possible using IEEE video and teleconferencing tools.

4. IEEE recommends that If you have any questions, you contact your OU staff business solutions manager or OU volunteer leadership.
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