Conference Brief
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2021 IEEE International Electron Devices Meeting (IEDM)

IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

San Francisco, CA, USA
Hybrid Event
11-15 December 2021

2021 IEEE 47th European Solid-State Circuits Conference (ESSCIRC)
2021 IEEE 51st European Solid-State Device Research Conference (ESSDERC)

6-9 September 2021
Virtual Event

The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.The level of integration for system-on-chip design is rapidly increasing.

This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers and system designers is necessary. ESSCIRC and ESSDERC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both device and circuit communities.

Attendees registered for either conference are encouraged to attend any of the scheduled parallel sessions, regardless to which conference they belong.

2022 23rd International Symposium on Quality Electronic Design (ISQED'22) 

April 2022 | California, USA

Submission Deadline:
14 September 2021

Conference Website

2022 6th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 

6-9 March 2022 | Oita, Japan

Submission Deadline:
18 October 2021

Conference Website

2022 34th IEEE International Conference on Microelectronic Test Structures

21-24 March 2022 | Cleveland, OH

Submission Deadline:
29 October 2021

Conference Website

Tucson AZ / Hybrid Event | 26 September - 1 October 2021
Virtual Event | 6-8 October 2021
New TCS Fee Structure
IEEE introduced Technical Co-Sponsor Fees (TCS Fees) in 2018 for all technically co-sponsored conferences in which there is no IEEE financial interest (0%). Please note that there will be a new TCS Fee structure in effect for any conferences occurring after 31 December 2020.

You may refer to the following bullets for guidance on the appropriate review process for your transaction.
  • US $1,450 per event
  • US $22 for each paper submitted to IEEE Xplore®
Technical Co-Sponsors have the option to pass this fee on to their conferences. If this occurs, the conference is responsible for paying a portion of the fee. Conferences should be mindful of this cost when budgeting for their event.

Below are the IEEE requirements for all IEEE financially sponsored conferences. All IEEE EDS conferences must abide by these guidelines in order to have compliant contracts.

If you have any questions or need assistance, please contact Jessica Lotito, CMP at the IEEE EDS office at [email protected].

Contract review
All conference-related purchase transactions valuing US$1,000 or greater must be reviewed by the IEEE Conference Contracts Department before execution.

You may refer to the following chart for guidance on the appropriate review process for your transaction.
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